Micheal Klick

Michael Klick is CEO of Plasmatrex GmbH and lecturer at the Ruhr-University-Bochum since 2008 (Plasma and RF technology for semiconductor, MEMS, and PV applications). He obtained his PhD in Plasma Physics from the Ernst-Moritz-Arndt-University Greifswald, Germany, in 1992. From 1995 he has worked in the semiconductor industry with regard to plasma process models, in particular nonlinear modeling of industrial RF plasmas (boundary sheath). He was in charge of the development of plasma sensor systems for etch and deposition plasmas. Being involved in many plasma process and equipment projects, he is very familiar with industrial plasma process equipment and its model-based description.

 

Key Publications

  1. Resistive Model of the RF Discharge including additional DC Currents and Electrodes, M. Klick, Phys. Rev. E 47(1993), 591.
  2. Nonlinearity of the Radio-frequency Sheath, M. Klick, J. Appl. Phys. 79 (1996), 3445
  3. Plasma Diagnostics in RF Discharges using nonlinear and Resonance Effects, M. Klick, W. Rehak, M. Kammeyer, Jpn. J. Appl. Phys. 36(1997), 4625.
  4. SEERS-based Process Control for Plasma Etching, S. Wurm, W. Preis, M. Klick, Solid State Technology 42 (1999), 103.
  5. Microscopic Approach to an Equation for the Heat Flow. between Wafer and E-chuck, M. Klick, M. Bernt, J. Vac. Sci. Technol. B24 (2006), 2509.
  6. Electron Heating in capacitively coupled Discharges and reactive Gases, G. Franz, M. Klick, J. Vac. Sci. Technol.  B23 2005, 917.
  7. Comprehensive understanding of chamber conditioning effects on plasma characteristics in an advanced capacitively coupled plasma etcher, Kye Hyun Baek, Eunwoo Lee, Michael Klick, and Ralf Rothe, J. Vac. Sci. Technol. A 35, 021304 (2017); doi: 10.1116/1.4968206
  8. Ion energy control in an industrial ICP etch chamber without bias power usage, Michael Klick and Hans-Peter Maucher, J. Vac. Sci Technol. B 40, 012203 (2022); https://doi.org/10.1116/6.0001477